featuring the Systems-on-a-Chip (SoCs) for Space Workshop!
(SEE Symposium featuring SoCs for Space Workshop)
May 17 – 21, 2027
Marriott La Jolla
San Diego, California
Call for Papers
The Single Event Effects (SEE) Symposium and Military and Aerospace Programmable Logic Devices (MAPLD) Workshop is now known as the Single Event Effects Symposium featuring the Systems-on-a-Chip for Space Workshop (SEE/SoCS)! The 2027 workshop is to be held May 17-21, 2027 in La Jolla, California. Please join us!
SEE/SoCS 2027 will include an interactive, full day tutorial once again.
We are seeking contributions in topical areas highlighted below and adjacent domains but all submissions will be reviewed. Four sessions are available: SEE, SoC, Combined and Poster. The Combined Session includes submissions that cross the SEE and SoC themes. The Poster Session can include SEE, SoC or Combined content. Please refrain from technical content reasonably classified as product marketing.
Submission Deadline
will be announced in early January 2027
The conference committee will notify all prospective speakers of acceptance status.
We encourage submissions focusing on, but not limited to:
For the Single Event Effects Symposium
- Latest and greatest SEE test data
- SEE Test Facilities (High Energy Heavy Ion, Heavy Ion, proton, neutron, …)
- Pulsed Lasers
- New models, tools, simulations and suites (design and analysis)
- Test methods, best practices, guidelines, and standards
- SEE Assurance and Mission Systems
- Hardening / mitigation at system level
- Fault propagation
- Alternate SEE Test Platforms
- In-orbit data
- Training and workforce development
- Data Sharing and Communication Platforms
- SEE Space Environments
- Special session on Wide Bandgap power devices and testing
- Alternate SEE Assurance methods
For the System-on-a-Chip for space Workshop
- SoCs, FPGAs, GPUs, TPUs, Neuromorphic processors
- AI/ML, neural nets
- SoC design, verification, and validation tools and methods
- Standards, guidelines and best practices
- Applications and optimization
- Radiation performance
- Security
- Flight experience
- 2.5/3D packaging
- Reliability, Assurance and test challenges
Abstract submission guidelines are available here
All presentations must be approved for unlimited public distribution (Distro A) or equivalent
It is the authors responsibility to ensure compliance with their home institutions publication policies
Contact Us
Justin Likar, JHU/APL, General Chair
Ian Troxel, Troxel Aerospace Industries, Inc., SoCS Chair
George Tzintzarov, The Aerospace Corporation, SEE Technical Chair
Codie Mishler, Northrop Grumman, Tutorial Chair
Martha O’Bryan, TSS, Poster Session Chair
Larisa Milic, EMPC, Exhibits Chair
Teresa Farris, Archon, LLC, Meeting Planner
Carl Szabo, CS Enterprises, A/V Chair